| 摘要 |
PROBLEM TO BE SOLVED: To provide a new TAB tape which is superior in adhesion, wire- bonding characteristics, and punching-out characteristics, together with a semiconductor device using it. SOLUTION: An adhesive sheet for a semiconductor device is provided which comprises a laminate, comprising at least one layer of a protective film layer and an adhesive layer. Here, the adhesive layer comprises polyamide (A), an epoxy resin (B), and a phenol resin (C), with the epoxy resin (B) comprising at least a compound, represented by a general expression (1) (where, at least two of R1-R6 are glycidyl ether groups, with the rest being selected from among hydrogen atom, lower alkyl group of carbon number 1-4, or halogen atom, which can be identical. |
