CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A circuit board for a semiconductor package is provided to prevent a short-circuit phenomenon between circuit patterns occurring in a singulation process, by making the circuit patterns not cross each other near a singulation line of the circuit board. CONSTITUTION: A resin layer(12) is an almost plate type. Conductive circuit patterns including a bond finger(14) and a ball land(16) are formed on one surface or both surfaces of the resin layer. The circuit patterns are separated by a predetermined distance from the singulation line(S) which is the circumference of the resin layer.