| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board having a curing composition for solder masks with improved low-dielectric characteristics, heat-resistance properties, moisture-resistance properties, and insulating resistance properties, and a solder mask obtained by curing the curing composition. SOLUTION: The multilayer circuit board is provided with the curing composition for solder masks including 50 wt.% or higher monomer units containing alicyclic structure, a weight average molecular weight of 5,000-1,000,000, and a polymer resin containing the alicyclic structure having a functional group and a curing agent, an inner-layer substrate having an electric insulating layer (1) and a conductor circuit (1), a build-up layer having an electric insulating layer (2) and a conductor circuit (2) formed on the inner-layer substrate, and a solder mask that includes 50 wt.% or higher monomer units containing the alicyclic structure on the build-up layer, a weight average molecular weight of 5,000-1,000,000, and is formed by curing the curing composition containing the polymer resin containing the alicyclic structure having a functional group and the curing agent. |
