发明名称 |
Connecting material and connection structure |
摘要 |
A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0. |
申请公布号 |
US2002009597(A1) |
申请公布日期 |
2002.01.24 |
申请号 |
US20010863288 |
申请日期 |
2001.05.24 |
申请人 |
SONY CHEMICALS CORP. |
发明人 |
SHINOZAKI JUNJI;TAKEICHI MOTOHIDE |
分类号 |
C08G59/50;C09J163/00;H01L21/58;H01L21/60;H01L23/29;H01L23/31;(IPC1-7):B32B27/38;C08F8/00 |
主分类号 |
C08G59/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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