发明名称 Surface treatment of darc films to reduce defects in subsequent cap layers
摘要 The present invention comprises a method for preventing particle formation in a substrate overlying a DARC coating. The method comprises providing a semiconductor construct. A DARC coating is deposited on the construct with a plasma that comprises a silicon-based compound and N2O. The DARC coating is exposed to an atmosphere that effectively prevents a formation of defects in the substrate layer. The exposed DARC coating is overlayed with the substrate.
申请公布号 US2002009829(A1) 申请公布日期 2002.01.24
申请号 US20010924759 申请日期 2001.08.08
申请人 MICRON TECHNOLOGY, INC. 发明人 YIN ZHIPING;SANDHU GURTEJ SINGH
分类号 G03F7/09;H01L21/027;H01L21/3105;H01L21/314;H01L21/3213;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 主分类号 G03F7/09
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