| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the following problems with the conventional printed circuit board; the printed circuit board is heretofore patterned by using UV and therefore an irradiation energy quantity is relatively weak and the time is needed for curing of resist, etc.; the enormous time is spent for patterning work; a reaction initiator is added to a resin as a means for promoting curing but there are problems, such as the lowering of the glass transition temperature of the resin or the like, which are extremely significant problems in productivity of the printed circuit board; the printed circuit board is made increasingly finer in wires and there is the threshold in the formation of the finer wires in patterning by UV. SOLUTION: The metal mask is formed by etching by using the clad foil for the metal mask which is formed by joining at least >=2 kinds of metallic sheets to each other and in which the metallic layers constituting the clad foil and varying in electron beam transmittance are metal-to-metal joined, and the printed circuit board is manufactured by electron beam exposure.</p> |
