| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device, a method for mounting the device, and a method for repairing the device, which can dismantle a semiconductor device filled with sealing resin from a printed circuit board without damaging the semiconductor device or the printed circuit board. SOLUTION: The mounting structure of a semiconductor device comprises a semiconductor device body 1, a printed circuit board 2, a solder ball 3 which electrically connects the semiconductor device body 1 to the printed circuit board 2, a sealing resin 5 which is filled between the semiconductor device body 1 and the printed circuit board 2 and bonds them together. In addition, the mounting structure comprise a wire 4 made of insulating material which is located between the semiconductor device body 1 and the printed circuit board 2, where the wire 4 makes the sealing resin 5 crack when the wire 4 is forced to move. |
