MULTIPLE LAYER SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To make possible in a semiconductor device manufacturing to achieve miniaturization and thinning of the semiconductor device, to improve the yield and to reduce production cost. SOLUTION: A circuit board is constituted by arranging a film type semiconductor package (10) containing a semiconductor chip (12) to a package accommodating hole (11a) of a wiring layer. A multilayer semiconductor device is formed by laminating circuit boards in a multiple layer, and the wirings 13 of respective circuit board are electrically connected together with a low melting point metal (14) or by a lead beam bonding (13b).