发明名称 |
VACUUM DEPOSITION APPARATUS, AND VACUUM DEPOSITION METHOD USING THE APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus, and a vacuum deposition method which can efficiently remove a metal layer deposited on an inner circumferential surface of a masking tape and prevent an oil for preventing the vapor deposition from coming around an outer circumferential surface of the endless masking tape and adversely affecting a polymer film. SOLUTION: This vacuum deposition apparatus is provided with a metal layer peeling roll 10 which can be advanced/retracted between a first position at which a circumferential surface thereof is pressed against the outer circumferential surface of the masking tape 7 to allow the masking tape to meander and a second position at which the circumferential surface thereof is not pressed against the outer circumferential surface of the masking tape 7 not to impede the rotational traveling of the masking tape 7 so that the metal layer vapor- deposited on the inner circumferential surface of the endless masking tape 7 via the metal layer peeling oil is peeled.</p> |
申请公布号 |
JP2002004035(A) |
申请公布日期 |
2002.01.09 |
申请号 |
JP20000179653 |
申请日期 |
2000.06.15 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ISHIDA MIKIO;YASUDA OSAMU;MORIWAKI MICHIYASU;TAMAKI SHIGERU;NISHIGORI YOSHITOMO |
分类号 |
C23C14/24;H01G4/015;H01G4/18;H01G13/00;(IPC1-7):C23C14/24 |
主分类号 |
C23C14/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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