| 摘要 |
<p>PROBLEM TO BE SOLVED: To feed conductive grains to connecting parts to stabilize connecting conditions and obtain connection reliability. SOLUTION: Aluminum pad electrodes are provided on a semiconductor element, metal electrodes are formed thereon, a photosensitive thermosetting resin layer is provided, the resin layer on the metal electrodes is removed through a mask and in an exposure-developing process, and an anisotropically conductive resin layer is formed on the metal electrodes surfaces and the photosensitive thermosetting resin layer surface.</p> |
