| 摘要 |
PROBLEM TO BE SOLVED: To prevent semiconductor wafers from being exposed to outside air to improve manufacturing yields when the semiconductor wafers are conveyed to and from the inside of a core tube. SOLUTION: A heat treatment apparatus includes a core tube 4 which is extended in a horizontal direction, a boat 10 for supporting a plurality of semiconductor wafers 6 which are aligned in a single line at intervals with wafer surfaces 8 being opposed to each other, and a fork 14 which supports and conveys the boat 10 through an opening 12 on an end of the core tube 4 and conveys the boat 10 from the inside of the core tube 4. Further, a gas spraying means 20 mounted on the fork 14 is provided. When the semiconductors 6 are conveyed into the core tube 4, and when the semiconductors 6 are conveyed from the core tube 4, the gas spraying means 20 sprays nitrogen gas 22 to the semiconductor wafers 6 to prevent the semiconductor wafers 6 from being exposed to outside air. |
