| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, which realizes a recycle property, a self-collapse function subsequent to a scrapping of the board and the like and an environmental protection, and to provide the manufacturing method of the multilayer printed wiring board. SOLUTION: The materials for boards, connecting pins, insulating layers and the like, which constitute a multilayer printed wiring board, are constituted of a thermoplastic resin, such as a polycarbonate, a polyethylene, a polyphenylene sulfide and a fluororesin, or a biodegradable resin, such as an aliphatic polyester, a cellulose mixture, a lactic acid and a starch, as a material formed in consideration of a recycle property. A bonding agent consisting of the thermoplastic resin or the biodegradable resin is used also as a bonding layer for bonding the boards to each other. The constitution of the connecting pins also uses the thermoplastic resin or the biodegradable resin. By these constitutions, the regeneration of the multilayer board in the case where the multilayer board becomes unnecessary is enabled and also in the case where the multilayer board is scrapped, the disassembly of the multilayer board becomes possible under the natural environment and the prevention of an environmental pollution is contrived.</p> |
