发明名称 |
Verbesserte elektronische Sicherungen durch die lokale Verschlechterung der schmelzbaren Verbindung |
摘要 |
Described herein is a fuse incorporating a covering layer disposed on a conductive layer, which is disposed on a polysilicon layer. The covering layer preferably comprises a relatively inert material, such as a nitride etchant barrier. The covering layer preferably has a region of relatively less-inert filler material. Upon programming of the fuse, the conductive layer, which can be a silicide, preferentially degrades in the region underlying the filler material of the covering layer. This preferential degradation results in a predictable "blowing" of the fuse in the fuse region underlying the filler material. Since the "blow" area is predictable, damage to adjacent structures can be minimized or eliminated.
|
申请公布号 |
DE10125407(A1) |
申请公布日期 |
2001.12.20 |
申请号 |
DE2001125407 |
申请日期 |
2001.05.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK |
发明人 |
KORHANDARAMAN, CHANDRASEKARAN;GRELLNER, FRANK;IYER, SUNDAR KUMAR |
分类号 |
H01L21/82;H01L23/525;(IPC1-7):H01L23/525 |
主分类号 |
H01L21/82 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|