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发明名称
Process for making through-hole connections by direct electroplating in double-layered circuit boards and multilayers
摘要
申请公布号
EP0707440(B1)
申请公布日期
2001.12.12
申请号
EP19950115426
申请日期
1995.09.29
申请人
BAYER AG
发明人
WOLF, GERHARD-DIETER, DR.;JONAS, FRIEDRICH, DR.;SCHOMAECKER, REINHARD, DR.
分类号
C25D5/54;C25D7/00;H05K3/42;H05K3/46;(IPC1-7):H05K3/42
主分类号
C25D5/54
代理机构
代理人
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地址
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