METHOD FOR MANUFACTURING SEMICONDUCTOR PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor pressure sensor capable of manufacturing a high sensitive semiconductor pressure sensor capable of detecting a minute pressure without increasing a chip size. SOLUTION: A method for manufacturing a semiconductor pressure sensor comprises the steps of forming a distortion sensing element in a silicon wafer; joining a capping substrate forming an opening gap coating the distortion sensing element and a silicon wafer; etching or polishing an opposite side surface to a surface forming the distortion sensing element in the silicon wafer joined to the capping substrate to thin a thickness of the silicon wafer; joining a pedestal substrate to an opposite side surface to the surface forming the distortion sensing element in the silicon wafer; and dicing in chip unit.