发明名称 |
Flexible epoxy encapsulating material |
摘要 |
A flexible encapsulating material resulting from a mixture that includes at least one epoxy novolak resin and at least two other epoxy compounds wherein the material has a percent hardness change of less than 20% after thermal aging of 504 hours at 140° C. The epoxy novolak resin preferably has less than 3 epoxy groups per molecule. A further embodiment is an electronic component encapsulated with a flexible material resulting from combining a two part system wherein a first part includes an epoxy novolak resin and at least two other epoxy resins and the second part includes at least one amine. An additional embodiment is a method for flexibly encapsulating an electronic component comprising applying to the component a mixture comprising an epoxy novolak resin having less than 3 epoxy groups per molecule and at least one other epoxy compound.
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申请公布号 |
US6322848(B1) |
申请公布日期 |
2001.11.27 |
申请号 |
US19990426483 |
申请日期 |
1999.10.26 |
申请人 |
LORD CORPORATION |
发明人 |
PHENIS MICHAEL T.;TAVARES MANNY |
分类号 |
C08L63/00;C08L63/04;H05K3/28;(IPC1-7):C08L63/04;C08L9/02 |
主分类号 |
C08L63/00 |
代理机构 |
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