| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor-sealed device which has an improved adhesive force between a resin composition and a perplating frame especially such as a Pd or Pd-Au frame, has improved reflow resistance, prevents moisture deterioration after reflowing, and has high reliability. SOLUTION: This resin composition for sealing, comprising (A) an epoxy resin, (B) a novolak phenolic resin, (C) zinc 2-benzamidothiophenolate, and (D) an inorganic filler as essential components, wherein (C) the zinc 2- benzamidotiophenolate and (D) the inorganic filler are contained in amounts of 0.004 to 0.2 wt.% and 25 to 95 wt.%, respectively, based on the resin composition. The semiconductor-sealed device characterized by sealing a semiconductor with the composition.
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