发明名称 |
Wafer notch polishing machine and method of polishing an orientation notch in a wafer |
摘要 |
The notch polishing machine employs a plurality of polishing tapes which can be sequentially introduced into the notch of a wafer to polish both sides of the notch, i.e. the top and bottom surfaces. Each tape is pulled off a supply reel and passed into a mounting block sized to fit into the wafer notch. Each block is also mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in common to be pivoted between a position angularly disposed relative to the top of the top of the wafer and a position angularly disposed relative to the bottom of the wafer.
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申请公布号 |
US6306016(B1) |
申请公布日期 |
2001.10.23 |
申请号 |
US20000631656 |
申请日期 |
2000.08.03 |
申请人 |
TSK AMERICA, INC. |
发明人 |
STEERE, JR. ROBERT E.;STEERE, III ROBERT E. |
分类号 |
B24B9/00;B24B9/06;B24B21/00;B24B21/08;B24B21/16;B24B27/00;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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