| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem where cracks, projection or gap occur on a provided multilayer ceramic substrate as a result since conductive paste for a wiring conductor formed on a green laminate starts shrinking on a stage so as not to exert a shrink suppression effect based on an inorganic material layer for shrink suppression upon a green sheet for substrate, in a burning process, when producing the multilayer ceramic substrate by burning the green laminate which laminates the green sheet for substrate containing low- temperature sintered ceramic materials and the inorganic material layer for shrink suppression, containing inorganic materials for shrink suppression. SOLUTION: The copper conductive paste containing Cu2O is used for forming a conductive paste 4. In the burning process, the shrinking action to occur, when reducing Cu2O to Cu is approximated with the shrinking action of low- temperature sintered ceramic materials contained in a green sheet 2 for substrate, by controlling partial pressure of oxygen in the burning atmosphere. |
