SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To stabilize the quality of a semiconductor device, while reducing the cost without causing warpage on a semiconductor element, even when the semiconductor comprises an elongated semiconductor element. SOLUTION: In an elongated semiconductor element 1, having wire bonding pads 3, the wire bonding pads 3 are arranged concentrically to the vicinity of the longitudinal center of the semiconductor element 1.