发明名称 ELECTROLESS PLATING PROCESS AND PRETREATING AGENT USED THEREFOR
摘要 PURPOSE: Provided is an electroless plating process for forming effectively a uniform plating film resorting to a synergistic effect to be brought about by a conductive metal oxide and a reduction catalyst metal such as palladium that are contained in a coating film of a pretreating agent(or solution or primer). CONSTITUTION: In the electroless plating process, a film containing a conductive metal oxide is formed on a surface of a nonconductive material, and the resulting nonconductive material is subjected to electroless plating. The pretreating agent contains at least a conductive metal oxide, a resin, and a substance which captures and immobilizes a reduction catalyst metal.
申请公布号 KR20010089839(A) 申请公布日期 2001.10.11
申请号 KR20000059687 申请日期 2000.10.11
申请人 DAISHIN CHEMICAL CO., LTD.;OMURA TORYO CO., LTD. 发明人 NAGANO HIROSHI;OMURA YOSHIHIKO
分类号 C23C18/18;(IPC1-7):C23C18/16 主分类号 C23C18/18
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