发明名称 |
ELECTROLESS PLATING PROCESS AND PRETREATING AGENT USED THEREFOR |
摘要 |
PURPOSE: Provided is an electroless plating process for forming effectively a uniform plating film resorting to a synergistic effect to be brought about by a conductive metal oxide and a reduction catalyst metal such as palladium that are contained in a coating film of a pretreating agent(or solution or primer). CONSTITUTION: In the electroless plating process, a film containing a conductive metal oxide is formed on a surface of a nonconductive material, and the resulting nonconductive material is subjected to electroless plating. The pretreating agent contains at least a conductive metal oxide, a resin, and a substance which captures and immobilizes a reduction catalyst metal. |
申请公布号 |
KR20010089839(A) |
申请公布日期 |
2001.10.11 |
申请号 |
KR20000059687 |
申请日期 |
2000.10.11 |
申请人 |
DAISHIN CHEMICAL CO., LTD.;OMURA TORYO CO., LTD. |
发明人 |
NAGANO HIROSHI;OMURA YOSHIHIKO |
分类号 |
C23C18/18;(IPC1-7):C23C18/16 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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