发明名称 |
Semiconductor flip-chip assembly with pre-applied encapsulating layers |
摘要 |
A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness. |
申请公布号 |
US6297560(B1) |
申请公布日期 |
2001.10.02 |
申请号 |
US19980137971 |
申请日期 |
1998.08.21 |
申请人 |
CAPOTE MIGUEL ALBERT |
发明人 |
CAPOTE MIGUEL A.;ZHU XIAOQI |
分类号 |
B23K35/02;B23K35/36;B32B7/12;C09J4/00;H01L21/48;H01L21/56;H01L21/60;H01L23/29;H01L23/433;H01L23/48;H01L23/498;H05K1/09;H05K3/32;(IPC1-7):H01L23/48 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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