| 摘要 |
PROBLEM TO BE SOLVED: To produce a panel efficiently while suppressing a warpage of a facing material, in which excess parts are removed. SOLUTION: The device for producing the panel is equipped with both a pressurizing device 15 for pressurizing a panel build-up body 3, in which an adhesive is applied to the interval of a metallic substrate 1 and a facing 2 having 0.01-100 mm thickness, at pressure of 0.02-10 kg/cm2 and an induction heating device 20, in which the facing material 2 is bonded to the metallic substrate 1 by heating the pressurized part of the panel build-up body 3.
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