| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device of high heat dissipation suited to cutting into individual pieces in the final stage of assembling through the use of a frame, where spreading of adhesive applied for adhering semiconductor chips is suppressed and the plural semiconductor chips are matrix-arranged, and the semiconductor device obtained by the method. SOLUTION: The method for manufacturing the semiconductor device has at least a stage for providing an upper groove at one side of a metallic plate of a heat spreader, a stage for adhering a board having a wiring layer to the metallic plate and filling the upper groove with resin, and a stage for forming a lower groove at the other surface of the metallic plate to connect the upper and lower grooves. The semiconductor device is obtained by the method defined above. |
