发明名称 Chip component take-in apparatus
摘要 A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.
申请公布号 US6290095(B1) 申请公布日期 2001.09.18
申请号 US20000571264 申请日期 2000.05.15
申请人 TAIYO YUDEN CO., LTD. 发明人 SAITO KOJI;YASUDA TARO;MATSUI HIROYUKI
分类号 B23P19/00;H05K13/02;(IPC1-7):B65H5/00 主分类号 B23P19/00
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