发明名称 METHOD FOR MANUFACTURING THICK PLATE MOTHER-OF-PEARL SHEET USING THIN PLATE MOTHER-OF-PEARL SHEET CHIPS, THICK PLATE MOTHER-OF-PEARL SHEET MANUFACTURED BY THE MANUFACTURING METHOD, AND DECORATIVE PATTERN APPLIED STRINGED MUSICAL INSTRUMENT OBTAINED BY CUTTING THE THICK PLATE MOTHER-OF-PEARL SHEET
摘要 PURPOSE: A thick plate mother-of-pearl sheet is provided which is economical by using fragments of a thin plate mother-of-pearl sheet, thereby obtaining sufficiently valuable patterns of mother-of-pearl, and has superior machinability of the cutting surface during laser cutting by using a laser-cutter. CONSTITUTION: The thick plate mother-of-pearl sheet (10) manufactured using thin plate mother-of-pearl sheet chips (10a) comprises a transparent plate (10b) material of synthetic resin having a thickness of 0.5 to 3 mm; a transparent adhesive (10c) coated on the plate; and thin plate mother-of-pearl sheet chips adhered on all over the surface of the plate by the adhesive, wherein the thick plate mother-of-pearl sheet further comprises a surface protective film of transparent synthetic resin material on the surface of the thin plate mother-of-pearl sheet chips (10a). The stringed musical instrument is inlaid with decorative patterns obtained by cutting the thick plate mother-of-pearl sheet using thin plate mother-of-pearl sheet chips into a certain shape as a position mark of a finger fingerboard, wherein the thin plate mother-of-pearl sheet chips comprise a transparent plate of synthetic resin material, a transparent adhesive material coated on the plate, and thin plate mother-of-pearl sheet chips adhered on all over the surface of the plate by the adhesive. The method for manufacturing the thick plate mother-of-pearl sheet using the thin plate mother-of-pearl sheet chips comprises a first process of coating transparent liquid phase epoxy, transparent liquid phase acrylic or transparent liquid phase formica as an adhesive on a transparent epoxy plate, transparent acrylic plate or transparent formica plate; and a second process of adhering thin plate mother-of-pearl sheet chips on the adhesive.
申请公布号 KR20010086934(A) 申请公布日期 2001.09.15
申请号 KR20000010936 申请日期 2000.03.04
申请人 YANG, YONG JIN 发明人 YANG, YONG JIN
分类号 B44C3/00;(IPC1-7):B44C3/00 主分类号 B44C3/00
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