发明名称 Radiation curable resin composition for cast polymerization
摘要 A radiation curable resin composition capable of producing molded articles which have excellent transparency, small light-coloring resistance, high dimensional accuracy, high surface hardness, and high thermal resistance. The radiation curable resin composition for cast polymerization, comprises (A) a (meth)acryloyl group-containing compound represented by the following general formula (1):wherein R1 represents a hydrogen atom or a methyl group, R2 represents an alkylene group or a hydroxyalkylene group having 2-6 carbon atoms, R3 represents a divalent organic group, n denotes an integer from 0 to 6, m denotes an integer from 1 to 10, and L denotes an integer from 0 or 1; (B) a (meth)acryloyl group-containing compound represented by the following general formula (2):wherein R4 represents a hydrogen atom or a methyl group, R5 represents an alkylene group having 2-6 carbon atoms, and p denotes an integer from 1 to 16; and (C) a radiation active initiator possessing a specific molar absorption coefficient, respectively in a specific amount.
申请公布号 US6288136(B1) 申请公布日期 2001.09.11
申请号 US20000502228 申请日期 2000.02.11
申请人 DSM N.V.;JSR CORPORATION;JAPAN FINE COATINGS, LTD. 发明人 UKON MASAKATSU;TAKAHASHI TOSHIHIKO;UKACHI TAKASHI
分类号 C08F2/02;C08F2/46;C08F2/48;C08F222/10;C08F290/06;C08F290/14;C09D4/00;C09D4/02;C09D4/06;(IPC1-7):C08F2/48 主分类号 C08F2/02
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