发明名称 DESIGN SUPPORT DEVICE FOR SUPPORTING ARRANGEMENT DESIGN OF PARTS INTO MULTI-LAYER WIRING SUBSTRATE AND ITS METHOD AND PROGRAM STORAGE MEDIUM
摘要 <p>PROBLEM TO BE SOLVED: To provide a design support device by which the arrangement design of parts into a multi-layer wiring substrate is made to be efficient. SOLUTION: A parts designating information acquiring part 1210 obtains information indicating the parts, a first position information acquiring part 1220 obtains position information indicating a position on a two-dimensional plane which orthogonally crossed with a laminating direction, a second position information acquiring part 1230 obtains position information indicating a position inside the substrate in the laminating direction of the substrate, a direction information acquiring part 1240 obtains angle information indicating a rotary angle when the parts are arranged by rotation, an arrangement position calculating part 1250 generates arrangement information indicating a space occupied by the parts to be arranged in a rotated direction by the obtained rotational angle at the position which is fixed by two obtained position information and an arrangement information output part 1260 outputs generated arrangement information. Thus, the design support device supports design for the arrangement of the parts to the inside of the substrate.</p>
申请公布号 JP2001243271(A) 申请公布日期 2001.09.07
申请号 JP20000389532 申请日期 2000.12.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IKEDA HIROSHI;MIURA SHINJI;FUKUMOTO YUKIHIRO;UEMURA HIROICHI;SAITO YOSHIYUKI;NAKAYAMA TAKESHI;SHIBATA OSAMU;TANIMOTO SHINICHI
分类号 G06F17/50;H05K3/00;H05K3/46;(IPC1-7):G06F17/50 主分类号 G06F17/50
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