发明名称 FIXING STRUCTURE OF POWER ELEMENT TO HEAT DISSIPATING MEMBER
摘要 <p>PROBLEM TO BE SOLVED: To transfer heat from power elements effectively to heat dissipating fins of a heat dissipating member. SOLUTION: Fixing support 41 are installed on at least both sides of the heat dissipating member having many heat dissipating fins on the upper surface. A spring plate material 37 and the power elements 29 are installed on a circuit board 35. When the spring plate material 37 is engaged with the fixing supports 41 of the heat dissipating member 5, the power elements 29 are fixed with pressure on the rear 5a of the heat dissipating member 5 by the spring plate material 37.</p>
申请公布号 JP2001244670(A) 申请公布日期 2001.09.07
申请号 JP20000057287 申请日期 2000.03.02
申请人 CALSONIC KANSEI CORP 发明人 SUNAGA HIDEKI;OHIRA SHIGENORI;SANO SHIGETO;YAMADA KAZUNORI;OBA TAKESHI
分类号 H01L23/40;H02K11/04;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
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