| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a mounting substrate with high density for achieving efficient cooling or constant temperature. SOLUTION: Conductive foil application substrates (2a and 2b) where conductive foil (3) is provided onto at least one surface are provided, a pattern circuit (4) where the conductive foil (3) is treated for forming and linear grooves (6a and 6b) where a specific place of the conductive foil (3) is locally recessed or is eliminated for forming are provided, the upper surfaces of the grooves (6a and 6b) are blocked for forming a fluid a fluid path (6) with a small sectional area, and a fluid-supplying device (9) for supplying fluid to the fluid path (6) is provided.
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