| 摘要 |
PROBLEM TO BE SOLVED: To obtain a substrate with a plating bump where the height of the plating bump is uniform. SOLUTION: The diameter of a blind via hole 1 is set to a small value (x=x1) at a part (y=y1) where the arrangement density of a blind via 1 is coarse, and the diameter of the blind via hole is set to a large value (x=x2) at a part (y=y2) where the arrangement density of the blind via 1 is dense, thus easily controlling plating growth speed, and hence obtaining the substrate with the plating bump where height (h) of each plating bump 4 is made uniform. |
