| 发明名称 |
SUBSTRATE STRUCTURE FOR PA MODULE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate structure of a PA module whose manhours and cost are reduced concerning a substrate of the PA module having a heat radiating plate. SOLUTION: Manhours and cost are remarkably reduced by constituting the substrate of a PA module of a flexible substrate 16. |
| 申请公布号 |
JP2001237354(A) |
申请公布日期 |
2001.08.31 |
| 申请号 |
JP20000048481 |
申请日期 |
2000.02.25 |
| 申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
DEMURA HITOSHI |
| 分类号 |
H05K1/02;H01L23/12;H01L23/36;H01L25/07;H01L25/18;(IPC1-7):H01L23/36 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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