| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can efficiently externally dissipate heat from heat generating surface of a Peltier element when cooled by the Peltier element. SOLUTION: The semiconductor device includes a semiconductor element 3 connected at its main surface to a surface of a carrier substrate 1 via bumps 2, an underfill resin 4 sealingly filled in a gap, a Peltier element 5 disposed on a rear side of the semiconductor element 3, a metallic plate 6a provided as tightly contacted with the Peltier element 5, and a metallic plate 6b for conducting heat from the metallic plate 6a to the substrate 1 and electrically connected thereto. Heat on the heat generating surface of the Peltier element 5 can be efficiently transmitted via the plates 6a and 6b to the substrate 1. Further, heat can be transmitted from the substrate 1 to a mother wiring substrate to increase a surface area to be dissipated to the air and to increase a heat dissipation efficiency. Thereby a temperature increase on the heat generating surface of the Peltier element 5 can be suppressed within a desired range. |
