MANUFACTURING METHOD OF BUILT-IN OBJECT OF ELECTRONIC CIRCUIT CHIP AND COMPONENT THEREWITH

摘要

PROBLEM TO BE SOLVED: To realize easy handling of an electronic circuit chip when it is mounted in paper. SOLUTION: An electronic circuit chip 10 is mounted on a water-soluble sheet 20. The water-soluble sheet 20 is handled, the electronic circuit chip 10 is made to sink in liquid or semi-liquid paper 30 together with the water-soluble sheet 20. After the water-soluble sheet 20 is dissolved, the paper 30 is dried and set. As a result, a paper wherein the electronic circuit chip 10 alone is practically embedded is obtained.