| 摘要 |
A heater is provided for use in substrate processing. In a first aspect, the heater is formed from a heater plate including an upper surface having at least one recess formed therein, a heater element wire disposed within the at least one recess and an electrically insulating and thermally conductive material disposed within the at least one recess so as to electrically insulate the heater element wire from the heater plate. Preferably a plurality of recesses are formed within the upper surface, a heater element wire is disposed within each recess and an electrically insulating and thermally conductive material is disposed within each recess so as to electrically insulate the heater element wire within each recess from the heater plate. A plurality of heating zones thereby may be formed. The electrically insulating and thermally conductive material preferably comprises a material deposited within the recess so as to embed the heater element wire within the electrically insulating and thermally conductive material. The electrically insulating and thermally conductive material also may comprise a plurality of insulating beads that surround the heater element wire. In a second aspect of the invention, the heater comprises a heater plate including an upper and a lower surface, the lower surface of the heater plate having a plurality of cooling fins or other surface features formed therein so as to increase the surface area of the lower surface. A method for cooling a heater also is provided wherein a lower surface of the heater's heater plate is sprayed with a cooling liquid so as to cool the heater. The temperature of the cooling liquid preferably is decreased gradually from a first temperature to a second temperature so as to cool the heater gradually.
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