发明名称 |
MODULE HAVING THIN FILM CIRCUIT, METHOD FOR MANUFACTURING MODULE HAVING THIN FILM CIRCUIT AND THIN FILM CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To provide a module having a thin film circuit including a passive component or a passive and active components on a board formed of an insulating material and needing only a small space. SOLUTION: In order to realize the module having the thin film circuit, a capacitor or a capacitor and a resistor or a capacitor, a resistor and an inductor are adjacently directly provided on a conductor track on the board 1 of the insulating material. A passive element is partly or completely integrated to create the module needing only a small space. |
申请公布号 |
JP2001223329(A) |
申请公布日期 |
2001.08.17 |
申请号 |
JP20000384225 |
申请日期 |
2000.12.18 |
申请人 |
KONINKL PHILIPS ELECTRONICS NV |
发明人 |
COPETTI CARLO;FLEUSTER MARTIN;SANDERS FRANCISCUS HUBERTUS M |
分类号 |
H05K1/09;H01L27/01;H05K1/03;H05K1/11;H05K1/16;H05K3/38;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H01L27/01 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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