Method for contacting a printed circuit board to a conductor arranged on a support, and device

摘要

The method is used to form an electric contact between a conductive track on a circuit board and a conductive track on a substrate (1). The substrate is preferably formed by injection molding partly of material which can be metalised and partly of material which rejects metal. The second conductive track is formed by metalising a metalisable part of the substrate. The first and second conductive tracks 38,40) are electrically connected and the circuit board is carried on the substrate. Independent claims also cover an apparatus.