| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance production efficiency by developing a process for improving etching accuracy and shortening manufacturing process, in the manufacturing of a stencil masking which aims at reducing the influence of microloading effect in a dry etching production process in the manufacturing process, and to enhance the dimensional accuracy of in a masking face. SOLUTION: A stencil mask manufacturing process in the preceding back etching process includes forming gradations of a film thickness of a resist left in a pattern field, after developing by adjusting the amount of exposed light, and selectively thinning a masking substrate film in a minute pattern formation field, with an aspect ratio higher than that of the surrounding region, prior to patterning.</p> |
