发明名称 |
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND THEIR MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package for making contribution to a small-size and thin body of a semiconductor device, along with easy operation of controlling and making the semiconductor device thin. SOLUTION: In a semiconductor package, a hole for storing a semiconductor element is formed on an insulating substrate, having a conductive part with a prescribed pattern. At the given position of the substrate, a through-hole with one end stuffed with a conductive part is formed, so that the through-hole is filled with a low melting point metal with the thickness of the metal equal to or higher than that of the substrate to form an outside connection terminal. |
申请公布号 |
JP2001210680(A) |
申请公布日期 |
2001.08.03 |
申请号 |
JP20000023315 |
申请日期 |
2000.01.27 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
HORIUCHI MICHIO;KURIHARA TAKASHI |
分类号 |
H01L25/18;H01L21/60;H01L25/065;H01L25/07;(IPC1-7):H01L21/60 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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