Fabrication method for integrated passive component

摘要

The present invention relates to a fabrication method for integrated passive component, comprising the steps of providing an insulator substrate and then planarizing the insulator substrate; forming integrated passive components on the insulator substrate; and packaging the integrated passive components by a thick film packaging method. The advantages of the method of the invention are that the fabricated components are miniaturized, the yield is high, and cost of production is low.