发明名称 LOCATION RING OF MOLD APPARATUS
摘要 PROBLEM TO BE SOLVED: To fix a location ring to a connection part when a mold is attached to a molding machine to form a projected part and to easily attach the mold to the molding machine by the projected part. SOLUTION: In a mold apparatus wherein a location ring is fixed to the connection part with a molding machine, a projected part is formed to the surface on the side of molding machine of the location ring within a range not exceeding the center line of the location ring.
申请公布号 JP2001191335(A) 申请公布日期 2001.07.17
申请号 JP20000040308 申请日期 2000.01.13
申请人 PENTEL CORP 发明人 OSAKI TERUMASA
分类号 B21D37/04;B29C33/30;B29C45/17;B29C45/26;(IPC1-7):B29C33/30 主分类号 B21D37/04
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