Electronic device substrate, electronic device, method of manufacturing electronic device substrate, method of manufacturing electronic device, and electronic apparatus

摘要

An electronic device substrate includes a resin layer, a semiconductor layer disposed in a first region on the resin layer, a plurality of insulating films disposed in the first region on the resin layer, and connection terminals disposed in a second region on the resin layer, the connection terminals being used for connection to an external component to be connected. The connection terminals in plan view do not overlap with any insulating films composed of an inorganic material among the plurality of insulating films.