发明名称 STRUCTURE OF SURFACE MOUNTING INFRARED COMMUNICATION MODULE AND DRIVING CIRCUIT
摘要 PROBLEM TO BE SOLVED: To improve the hear dissipation characteristics to raise the light emitting intensity of a light emitting element such as LED and avoid deteriorating the element in a surface mounting IR communication module. SOLUTION: The surface mounting IR communication module 20 has an IR light emitting element 2 connected to a pair of inner connection electrodes 3, 4 on an insulation substrate 1 and also connected to a pair of outer connection electrodes 5, 6 through through-holes 7, 8, 9, 10. One outer connection electrode 5 is connected to a shield case 25 having a heat radiating action. This improves the heat dissipation characteristic of the device and shields from harmful electromagnetic waves to improve the communication reliability.
申请公布号 JP2001185751(A) 申请公布日期 2001.07.06
申请号 JP19990368437 申请日期 1999.12.24
申请人 CITIZEN ELECTRONICS CO LTD 发明人 MIURA TAKESHI
分类号 H01L31/12;H01L33/48;H01L33/62;H01L33/64 主分类号 H01L31/12
代理机构 代理人
主权项
地址