| 发明名称 |
POLISHING METHOD, WIRE FORMING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technology which restricts a scratch, a peeling, a dishing and an erosion, and polishes at high polishing speed. SOLUTION: The polishing is made with a polishing liquid containing an oxidation substance, phosphoric and a protection film forming agent.</p> |
| 申请公布号 |
JP2001185515(A) |
申请公布日期 |
2001.07.06 |
| 申请号 |
JP19990368640 |
申请日期 |
1999.12.27 |
| 申请人 |
HITACHI LTD |
发明人 |
KONDO SEIICHI;FUJIMORI MASASHIGE;SAKUMA NORIYUKI;HONMA YOSHIO |
| 分类号 |
B24B37/00;B44C1/22;C09G1/04;C09K3/14;C23F1/18;C23F3/06;H01L21/302;H01L21/304;H01L21/3205;H01L21/321;H01L21/461;H01L21/768;H01L23/52;H01L23/532;(IPC1-7):H01L21/304;H01L21/320 |
主分类号 |
B24B37/00 |
| 代理机构 |
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