发明名称 HEAT PROCESSING APPARATUS
摘要 PURPOSE: A heat processing apparatus in which a resist sublimate or the like is difficult to stay is provided to prevent the temperature distribution of a processed substrate from becoming unstable, and to control the temperature of the processed substrate with high accuracy. CONSTITUTION: This heat processing apparatus is provided with a hot plate on or above which the processed substrate is loaded and that heats the processed substrate, a surrounding member provided so as to surround the heat processing space in which the heat processing substrate located above the hot plate is heat-processed, a sealing mechanism that almost seals the circumference of the surrounding member when the heat processing space is surrounded by the surrounding member, and an air current forming means that forms an air current from the outside circumference toward the center in the heat processing space.
申请公布号 KR20010060154(A) 申请公布日期 2001.07.06
申请号 KR20000061183 申请日期 2000.10.18
申请人 TOKYO ELECTRON LIMITED 发明人 KUBO MAKOTO;SAKAMOTO TAKAHIRO;YAMAGUCHI YOMITSU
分类号 G02F1/13;H01L21/00;(IPC1-7):G02F1/13 主分类号 G02F1/13
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