APPARATUS FOR CURING SEMICONDUCTOR PACKAGE AND CURING METHOD USING THE SAME

摘要

PURPOSE: An apparatus for curing a semiconductor package and a curing method using the same are provided to prevent warpage of a semiconductor package in a curing process after performing a molding process. CONSTITUTION: A curing oven has an inner space to provide a temperature condition for performing stably a curing process of a molding resin during a predetermined time. A compressor(14) is installed within the curing oven to compress a plurality of lead frame strip(24) loaded on a magazine(20). The compressor(14) prevents the warpage of a semiconductor package during the curing process. The compressor(14) is formed with a compressing plate(16) for compressing the lead frame(24) and a plurality of driving shaft(18) for driving the compressing plate(16).