PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition ensuring a short removal time and excellent in adhesion and resolution, a photosensitive element, a method for producing a resist pattern and a method for producing a printed wiring board. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having a 2C or 3C alkylene oxide group and at least one polymerizable ethylenically unsaturated group in one molecule and (C) a photopolymerization initiator. The photosensitive element is formed from the photosensitive composition. This element is laminated on a substrate for circuit formation and imagewise irradiated with active light, the exposed part is photo-cured and the unexposed part is removed by development to produce the resist pattern. The substrate with the produced resist pattern is etched or plated to produce the printed wiring board.