METHOD OF MANUFACTURING SOCKET AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent such a problem that a warpage occurs on a flexible film of a TCP type semiconductor device. SOLUTION: This socket for storing a semiconductor device is formed in a flexible film and comprises a lead with one end connected to the electrode pad of a semiconductor chip and the other end extracted to the outer peripheral side of the semiconductor chip. When the semiconductor device is stored, the connection part of a contact pin is connected to a part of the other end of the lead while rubbing against a part of the other end of the lead toward the tip of the other end of the lead.