| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring both high film leaving property and high sensitivity in practical use and excellent also in suitability to coating. SOLUTION: A dissolution inhibitor, preferably a polymer having a weight average molecular weight (expressed in terms of polystyrene) of 7,000-20,000 and <=1,500 Å/min velocity of dissolution in 2.38 wt.% tetramethylammonium hydroxide is incorporated into a photosensitive resin composition containing an alkali-soluble resin and a quinonediazido-containing sensitizer and the amount of the sensitizer is reduced to 1-18 pts.wt. based on 100 pts.wt. resin components in the composition. |
