POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which ensures high shelf stability of a solution of the composition, enhances dissolution contrast between unexposed and exposed parts and forms a pattern with high sensitivity and good resolution while maintaining a high rate of a residual film, a method for producing an accurate pattern of a good shape and high reliability electronic parts with a pattern obtained by the method. SOLUTION: The positive type photosensitive resin composition contains (A) a polyamide derivative having an aromatic ring and having a phenolic hydroxyl group in at least one end of its molecular chain and (B) a compound which forms an acid under light.